[headline margin=”low-margin”] AOI – FlipChip & Wafer Die Inspection [/headline]

 

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Pixen 6 – 600L Series Provide 12 Megapixels Imaging

  • Largest Board Size 600L X 510W
  • Up to 12 Micron Inspection Accuracy
  • 2D and 3D Inspection
  • Flip-Chip Die Inspection
  • Optional QC Inspector Station
  • Conveyor or Loader Ready Integration

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[headline margin=”low-margin”] Tape and Reel Vision Machine [/headline]

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Vision Tape & Reel –  2.0 Series 5 Megapixels 

  • Up to 160 FPS Inspection
  • 2D Measuring and Surface Defect Inspection
  • For IC Compnents, Small Meachinical Parts and Micron Components
  • Extreme Compact and Table Top Solutions
  • Highly Flexible Vision Configuration
  • Custom UV & NIR Inspection

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