Nexilon

AOI – FlipChip & Wafer Die Inspection 

 

 axmatic_pixen_6_aoi_machine

 

Pixen 6 – 600L Series Provide 12 Megapixels Imaging

  • Largest Board Size 600L X 510W
  • Up to 12 Micron Inspection Accuracy
  • 2D and 3D Inspection
  • Flip-Chip Die Inspection
  • Optional QC Inspector Station
  • Conveyor or Loader Ready Integration


Tape and Reel Vision Machine 

tape_and_reel_vision_machine 

Vision Tape & Reel –  2.0 Series 5 Megapixels 

  • Up to 160 FPS Inspection
  • 2D Measuring and Surface Defect Inspection
  • For IC Compnents, Small Meachinical Parts and Micron Components
  • Extreme Compact and Table Top Solutions
  • Highly Flexible Vision Configuration
  • Custom UV & NIR Inspection